Senior Package Design Engineer (WLCSP/Flip-Chip)

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Cirrus Logic in Edinburgh is seeking a Staff Package Design Engineer to develop cutting-edge packaging solutions for high-performance products. The role requires close collaboration with teams to drive design and enhance manufacturability.

Applicants should have a BS or higher in relevant engineering fields and demonstrable experience in packaging. Expertise in tools like AutoCAD and Cadence SiP layout is essential. This position promotes a diverse and inclusive workplace.

#J-18808-Ljbffr”, “datePosted”: “2026-05-20”, “hiringOrganization”: { “@type”: “Organization”, “name”: “Cirrus Logic”, “sameAs”: “https://uk.whatjobs.com/pub_api__cpl__436996465__4861?utm_campaign=publisher&utm_medium=api&utm_source=4861&geoID=31” }, “jobLocation”: { “@type”: “Place”, “address”: { “@type”: “PostalAddress”, “addressLocality”: “City of Edinburgh” } } }
Company: Cirrus Logic
Apply for the Senior Package Design Engineer (WLCSP/Flip-Chip)
Location: City of Edinburgh
Job Description:

Cirrus Logic in Edinburgh is seeking a Staff Package Design Engineer to develop cutting-edge packaging solutions for high-performance products. The role requires close collaboration with teams to drive design and enhance manufacturability.

Applicants should have a BS or higher in relevant engineering fields and demonstrable experience in packaging. Expertise in tools like AutoCAD and Cadence SiP layout is essential. This position promotes a diverse and inclusive workplace.

#J-18808-Ljbffr…

Posted: May 20th, 2026