Physical Designer Engineer
Responsibilities
- Responsible for the physical design of advanced process digital ASIC/AI/CPU chips, layout design of analog/digital chips, PPAC optimization under advanced processes, fully custom design, and exploration of new technologies in advanced packaging
- Multiple tasks including but not limited to: back-end physical implementation from gate-level netlist to GDSII, layout design of digital/analog chips, including PR, PV, IR signoff, PPAC optimization, and STA/Spice signoff
Requirements
- Understanding of the IC development
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