Principal Packaging Engineer

My client is seeking a Principal Packaging Engineer to lead the design and development of cutting-edge advanced packaging technologies.

What you’ll do:

• Lead and architect innovative 3D/2.5D packaging solutions from concept to prototype
• Oversee design, assembly, testing, and validation of advanced packaging demonstrators
• Define technology roadmaps and guide multiple packaging projects.
• Collaborate with internal and external teams to solve system-level integration challenges
• Represent the company in technical forums, proposals, and collaborative bids

About you:

• Proven experience in advanced semiconductor packaging – 3D/2.5D
• Strong, extended knowledge of design, modelling, assembly, and validation processes
• Skilled in signal/power integrity and thermal management
• Excellent communication, leadership, and problem-solving skills
• Track record of delivering demonstrators and leading cross-functional teams

Benefits include:

• 15% pension (10% employer)
• Annual bonus
• Private medical insurance extended to family
• Visa sponsorship and financial relocation assistance

If you’re looking for a strategic, hands-on role aims to define and deliver next-generation packaging for AI applications, contact Ella Flynn at IC Resources

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