Senior Packaging Process Engineer

My client is seeking a Senior Packaging Process Engineer with strong expertise in 3D semiconductor integration and high-density interconnects. This is an onsite position, based in Wales.

The role focuses on developing and validating 2.5D/3D packaging solutions, including fine-pitch interposers, advanced substrates, TSVs, and heterogeneous system-in-package (SiP) architectures. A key requirement is hands-on experience with integration and die bonding.

Responsibilities:

• Develop and lead 3D/2.5D advanced packaging processes using high-density interconnects
• Define and validate packaging process flows in collaboration with electrical and system designers
• Support package–silicon co-design, including signal and power integrity considerations
• Lead prototyping, troubleshooting, and process optimisation activities

Key requirements:

• Hands-on experience with 3D/2.5D integration and die bonding
• Experience in designing and developing new advanced assembly processes
• Strong understanding of electrical design considerations for advanced packaging
• Background in advanced assembly, bonding, and packaging process development
• Ability to lead technical work and collaborate across multidisciplinary R&D teams

Benefits:

• Competitive salary with annual performance bonus
• 15% pension (10% employer contribution)
• Private medical and dental insurance extended to family
• Life assurance at 4× annual salary
• Visa sponsorship and financial relocation assistance

If you are interested, please contact Ella Flynn @ IC Resources

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