Lead Packaging Engineer, 2.5D/3D AI Hardware

A pioneering technology company in the UK is seeking a Senior/Staff Packaging Engineer to lead the design and integration of advanced packaging solutions for AI hardware. The ideal candidate will have over 8 years of experience in semiconductor packaging, expertise in 2.5D and 3D architectures, and strong problem-solving skills. This role offers a competitive salary of £109,000+, equity options, comprehensive healthcare, and robust relocation support for candidates from around the world. #J-18808-Ljbffr