We are looking for a Munich based IC Test Engineer for our customer in Munich, Germany. This opportunity requires an onsite presence at the customer's site at least 3 days per week, every week. The role can be contract or contract to permanent. Must have working rights for Germany or EU. Candidates available on a remote basis only will not be considered.
Responsibilities
- Partner with design teams from early development stages to review DFX architecture and define comprehensive test requirements.
- Develop test methodologies and generate test content for high-speed embedded IP interfaces (LPDDR4/5, PCIe Gen4/5, MIPI D/C/MPHY).
- Perform test program development, pattern conversion, and pre‑silicon validation (virtual simulations).
- Support load board and probe card design.
- Lead post‑silicon debug to enable timely delivery of samples to internal and external customers.
- Drive test characterization and optimization to meet automotive quality standards.
- Collaborate with Quality & Reliability teams to execute qualification plans efficiently.
- Lead production test deployment with tier‑one foundries and OSATs for high‑volume wafer sort and final test operations.
Requirements
- BSc or MSc in Electrical Engineering.
- 7+ years of experience in IC Product/Test Engineering.
- Proven hands‑on experience in bring‑up and productization of complex ICs.
- Experience with Teradyne UltraFlex/UltraFlexPlus would be a strong advantage.
- Deep knowledge of structural DFT methodologies (Scan, MBIST, JTAG).
- Proficiency in C/C++ and scripting (Python, Perl) in a Unix environment.
- Strong data and yield analysis skills using statistical tools (e.g., JMP).
- Familiarity with Verilog and RTL simulations would be an advantage.
If this role is a match to your skillset, please email me for more information amy.hardiman@chipright.com, along with your updated CV.
Principal Analog AMS RF Recruitment Specialist
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