Laser Diode Packaging Lead - Hands-on Tech Leader (Rugby)

Platform Recruitment is looking for a Semiconductor Packaging Technical Lead based in Rugby, England, offering a salary between £60,000 and £70,000. This hands-on role involves driving the development of laser diode packaging technologies while leading a specialist engineering team. The ideal candidate will possess proven experience in project leadership, extensive knowledge of semiconductor packaging materials, and understanding of quality assurance methodologies. Join an innovative engineering team and make a significant impact by developing advanced fabrication techniques. #J-18808-Ljbffr