Semiconductor Packaging Technical Lead | Rugby | £60,000 – £70,000
A technology-focused organisation operating in a highly specialised engineering field is seeking a Semiconductor Packaging Technical Lead. The company develops advanced products used across a range of technical and commercial applications.
This role requires a practical, hands-on individual to drive the development of laser diode packaging technologies while leading a growing, specialist engineering team. The position is based on-site in Rugby.
Key Responsibilities
- Lead and coordinate technical projects and team activities
- Take ownership of product development and associated manufacturing processes
- Design and develop high-power semiconductor laser diode packages
- Support the scaling and enhancement of production capabilities
Skills and Experience
- Proven experience in project leadership and team management
- Strong technical background with the ability to interpret scientific and engineering literature
- Extensive knowledge of semiconductor packaging materials and processes
- Understanding of quality assurance and control methodologies
Join a forward-thinking engineering team where your skills directly contribute to the build of high-quality machinery used around the world. If you’re looking for a hands‑on role with real impact, opportunities to develop advanced fabrication techniques, and a supportive environment, we’d encourage you to apply.
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