GaN Packaging Engineer – High-Density Power

{ “@context”: “http://schema.org”, “@type”: “JobPosting”, “title”: “GaN Packaging Engineer – High-Density Power”, “description”: “Cambridge GaN Devices is seeking a Packaging Engineer to join their team based in Cambridge, UK. This role involves developing high-performance packaging solutions for GaN power devices, working closely with internal and external stakeholders. Candidates should have a relevant degree, experience in 3D Multiphysics Simulation, and strong problem-solving skills. The company offers excellent benefits including a share options scheme, pension contribution, flexible work options, and a supportive work environment.#J-18808-Ljbffr”, “datePosted”: “2026-05-02”, “hiringOrganization”: { “@type”: “Organization”, “name”: “Cambridge GaN Devices”, “sameAs”: “https://uk.whatjobs.com/pub_api__cpl__420922284__4861?utm_campaign=publisher&utm_medium=api&utm_source=4861&geoID=126” }, “jobLocation”: { “@type”: “Place”, “address”: { “@type”: “PostalAddress”, “addressLocality”: “Cambridge” } } }