Our leading Cambridge based semiconductor client is currently searching for a Senior Packaging Engineer to lead the development of advanced semiconductor packaging solutions for high-performance GaN power products. The role will involve driving package design, simulation, and qualification, working closely with internal teams and international partners to deliver differentiated, high-density solutions aligned with the product roadmap. This is a hands-on technical leadership role covering simulation, design, supplier collaboration, qualification, and product support — from concept through to high-volume manufacturing.
Required skills for the Senior Semiconductor Packaging Engineer will include:
- 3D multiphysics simulation (COMSOL, ANSYS or similar)
- Semiconductor assembly knowledge (wirebond, flip-chip, embedded)
- Thermal characterisation and reliability testing experience (JEDEC, AEC-Q100)
Please contact Rachel Anderson for further details.
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