THE ROLE:
Being in External Manufacturing Operations (Backend Engineering), this role is required to drive thermal cooling manufacturing suppliers on delivering key performance indices in terms on issue free New Product launch/ramp up, consistency with predictable outcome in HVM and enabling new manufacturing capabilities.
THE PERSON:
You must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive & ability work in a fast-paced multi-tasking environment. You would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good executive presentation & communication skills. Be creative and think out of box to challenge current process / design, provide constructive and objective idea with cost and efficiency improvement.
KEY RESPONSIBILITIES:
- Facilitate DFY/DFM through close coordination with AMD's internal core team and external suppliers during NPI introduction, ensuring consistent large-scale production of complex cooling architectures such as microchannel cold plates.
- Establish manufacturing readiness in terms of process/equipment/control setup prior to product launch.
- Drive suppliers to improve processes throughout the product lifecycle.
- Drive suppliers on issue resolution and issue prevention
- Plan and execute change management from internal or external parties.
- Drive supplier to establish manufacturing analytics to prevent issue excursion.
- Involve in regional supplier management – drive to meet Key Performance Indices
- Overseas travelling as required.
- Assist in additional duties as deemed fit by supervisor.
PREFERRED EXPERIENCE:
- Experience in Thermal Cooling manufacturing HVM facility/ experience in supplier management of thermal cooling manufacturing.
- Strong knowledge in heat transfer, thermal cooling solution for board/rack level to data center standards. (thermal cooling simulation is added advantage).
- Track record of development/manufacturing control work leading to volume production in thermal cooling fabrication to support board/rack level thermal cooling performance.
- Good leadership and interpersonal relationship.
ACADEMIC CREDENTIALS:
- Bachelor’s or Master’s degree in Mechanical Engineering or Materials Science.
THE ROLE:
Being in External Manufacturing Operations (Backend Engineering), this role is required to drive thermal cooling manufacturing suppliers on delivering key performance indices in terms on issue free New Product launch/ramp up, consistency with predictable outcome in HVM and enabling new manufacturing capabilities.
THE PERSON:
You must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive & ability work in a fast-paced multi-tasking environment. You would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good executive presentation & communication skills. Be creative and think out of box to challenge current process / design, provide constructive and objective idea with cost and efficiency improvement.
KEY RESPONSIBILITIES:
- Facilitate DFY/DFM through close coordination with AMD’s internal core team and external suppliers during NPI introduction, ensuring consistent large-scale production of complex cooling architectures such as microchannel cold plates.
- Establish manufacturing readiness in terms of process/equipment/control setup prior to product launch.
- Drive suppliers to improve processes throughout the product lifecycle.
- Drive suppliers on issue resolution and issue prevention
- Plan and execute change management from internal or external parties.
- Drive supplier to establish manufacturing analytics to prevent issue excursion.
- Involve in regional supplier management – drive to meet Key Performance Indices
- Overseas travelling as required.
- Assist in additional duties as deemed fit by supervisor.
PREFERRED EXPERIENCE:
- Experience in Thermal Cooling manufacturing HVM facility/ experience in supplier management of thermal cooling manufacturing.
- Strong knowledge in heat transfer, thermal cooling solution for board/rack level to data center standards. (thermal cooling simulation is added advantage).
- Track record of development/manufacturing control work leading to volume production in thermal cooling fabrication to support board/rack level thermal cooling performance.
- Good leadership and interpersonal relationship.
ACADEMIC CREDENTIALS:
- Bachelor’s or Master’s degree in Mechanical Engineering or Materials Science.
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