Principal Packaging Engineer: Lead 3D/2.5D AI Packaging

IC Resources is looking for a Principal Packaging Engineer in the United Kingdom to lead the design and development of cutting-edge 3D/2.5D packaging technologies. This role requires proven experience in advanced semiconductor packaging and strong leadership skills. You will oversee the design, assembly, testing, and validation of packaging demonstrators while representing the company in technical forums. Benefits include an annual bonus and private medical insurance. Visa sponsorship and financial relocation assistance are also provided.#J-18808-Ljbffr…