Company: Oho Group
Location: London
Job Description:
A global semiconductor company is looking for a Senior Packaging Engineer to own the technical development of medium-to-high performance semiconductor packaging solutions. This is a 0-1 role encompassing client relationships, R&D, design and production.
What’s in it for you
- Utilise your creativity across a range of different industries spanning aerospace, medical, automotive and more. Every project brings its own challenges and opportunities
- Liaise with clients across the globe to understand their unique requirements and find innovative engineering solutions to match their needs
- Shape and drive projects from the beginning to end of the packaging lifecycle
- Work within a passionate and open environment, where every new idea is valued
Key responsibilities
- Evaluate and select appropriate package technologies to support product requirements.
- Support packaging technology development with suppliers and manufacturing partners.
- Design semiconductor packages including wirebond, flip-chip, embedded, and advanced package solutions.
- Optimise package performance for size, electrical characteristics, and thermal efficiency.
- Improve design tools, processes, and development methodologies.
- Maintain awareness of industry developments and emerging packaging technologies.
- Support testing teams and customers with package documentation, thermal models, and technical guidance.
- Review and report package assembly and manufacturing data.
If you feel like you would be a good fit for this role, please click ‘Apply’ and let’s get the ball rolling!
…
Posted: May 24th, 2026