Senior IC Packaging Engineer — 2.5D/3D Packaging

IC Resources is seeking a Senior Packaging Process Engineer to lead microelectronics assembly and validation for advanced packaging technologies. This role involves developing 2.5D and 3D integration processes and designing interconnect solutions for packaging platforms.

While remote work is possible, candidates should be open to onsite requirements in Wales. Expertise in semiconductor packaging and strong analytical skills are essential for driving innovative technical projects.

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