Job Overview
Microchip’s Advanced Packaging team delivers competitive advantage by enabling the next generation of highly integrated, miniaturised electronic solutions. As a Principal Test Engineer, you will play a critical role in the design, development and industrialisation of next‑generation electronic modules, shaping test strategy, driving technical direction and collaborating across a multi‑disciplinary environment to deliver robust, scalable and high‑performance solutions.
Key Responsibilities
- Define and lead test strategies to enable efficient, high‑quality product verification and validation.
- Translate customer and product requirements into clear, robust test specifications.
- Architect and develop advanced test systems (hardware and software), including rack‑based and embedded solutions.
- Drive data analysis and interpretation to validate performance against application requirements.
- Lead risk management activities (e.g., FMEA) and ensure compliance across development programmes.
- Champion continuous improvement, including measurement systems analysis and test optimisation.
- Collaborate across engineering disciplines to communicate results, influence decisions and solve complex problems.
Requirements / Qualifications
- Degree (or equivalent) in Electrical/Electronic Engineering or related discipline.
- Proven experience in a senior/principal test engineering role within a complex engineering environment.
- Strong application development expertise in Visual Basic and Visual C# is essential.
- Experience with embedded systems and communication protocols (UART, SPI, I2C).
- Knowledge of test hardware design, including NI‑based systems and custom test platforms.
- Circuit design and PCB layout design using software such as Altium is desirable.
- Strong project leadership skills with the ability to drive programmes and influence stakeholders.
- Structured, analytical and commercially aware, with excellent communication and problem‑solving skills.
Travel: 0% – 25%
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