My client is looking for a Senior Packaging Process Engineer, to be an expert in leading microelectronics assembly and validation, specialising in advanced packaging technologies. The Senior Packaging Process Engineer will work on advanced AI infrastructure, co-packaged RF architectures, and photonic systems. Develop advanced packaging assembly processes including 2.5D and 3D integration Define interconnect schemes including flip chip, wafer-level packaging and hybrid bonding Lead design-for-manufacturing activities with internal and external teams Lead technical projects and contribute to proposals and funding activities Provide technical guidance across multidisciplinary engineering teams
Strong experience in semiconductor packaging and microelectronics assembly Hands-on experience with 2.5D/3D integration, hybrid bonding and SiP Knowledge of TSV, RDL and wafer-level packaging processes Experience leading R&D or packaging development projects Understanding of electrical, thermal and system-level integration challenges Competitive salary~ Life Assurance – 4 times annual salary~15% pension~28 days annual leave in addition to bank holidays~ Private medical insurance for you and your family~ Visa Sponsorship and financial relocation assistance~ Flexible working hours…