Senior Package Design Engineer (WLCSP/Flip-Chip)

Company: Cirrus Logic
Apply for the Senior Package Design Engineer (WLCSP/Flip-Chip)
Location: City of Edinburgh
Job Description:

Cirrus Logic in Edinburgh is seeking a Staff Package Design Engineer to develop cutting-edge packaging solutions for high-performance products. The role requires close collaboration with teams to drive design and enhance manufacturability.

Applicants should have a BS or higher in relevant engineering fields and demonstrable experience in packaging. Expertise in tools like AutoCAD and Cadence SiP layout is essential. This position promotes a diverse and inclusive workplace.

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Posted: June 6th, 2026