Company: Oho Group
Location:
Job Description:
Oho Group is seeking a Senior Packaging Engineer to lead technical development in semiconductor packaging solutions. This role requires the evaluation and selection of appropriate package technologies while liaising with clients worldwide. You will be at the forefront of R&D and design across industries such as aerospace and medical.
The ideal candidate holds a Master’s degree and possesses strong experience with semiconductor packaging and assembly processes. Join an innovative environment where your ideas are valued.
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Posted: June 6th, 2026