IC Package Design Engineer – High-Performance Packaging

Company: Qualcomm
Apply for the IC Package Design Engineer – High-Performance Packaging
Location: Cambridge
Job Description:

Qualcomm in Cambridge is seeking an IC Package Design Engineer to work onsite. This role involves package design responsibilities, working with multi-functional teams to optimize performance of Qualcomm products.

The ideal candidate will have a Bachelor’s degree in Engineering and proficiency in Cadence Allegro tools. Competitive salary and benefits such as maternity leave and gym membership are offered.

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Posted: June 19th, 2026