Senior Advanced Packaging & PDN Architect (2.5D/3D)

Axelera AI is seeking a Senior Advanced Packaging & Power Delivery Engineer to shape the silicon architecture of AI accelerators. This role involves overseeing power delivery design and advancing packaging technologies. You will collaborate closely with cross-functional teams to ensure product alignment and performance.

The ideal candidate should possess a relevant degree and have over 7 years of experience in power delivery and packaging design in the semiconductor field. Flexible working arrangements are available, including remote options.

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