Lead 3D Packaging & Cryogenic Interconnect

Quantum Motion, a leader in quantum computing located in London, is seeking a visionary 3D Integration and Advanced Packaging lead to manage complex, multi-chip module R&D. You will recruit and lead a high-performing team to bridge silicon spin qubit devices with scalable quantum systems.

The ideal candidate will have a Master’s or PhD in a relevant field and over 7 years of extensive experience in 3D integration technologies. Attractive benefits include a competitive salary and options scheme, alongside a contributory pension.

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